Home > Plastic Auxiliary Equipment > Contour Motion Dispensing Machinery |
Contour Motion Dispensing Machinery |
Contour Motion Dispensing Machinery are a type of plastic auxiliary equipment that is employed for bonding, sealing, gasketing, automated molding and scripting. These machines offer automated technologies for single-component and two-component bonding and sealing facilitate smooth and efficient running of molding machinery. Although most Contour Motion Dispensing Machines are automated, some manual types also exist.
What are the materials used by Contour Motion Dispensing Machinery?
These high-tech machines use a wide variety of raw materials for sealing and gasketing depending mainly on their adhesive properties. Some of the mostcommonly used materials are listed below :
- Epoxy
- Silicones
- Urethanes
- Silicones
- Most Reactive Resin Systems
Salient Features of Contour Motion Dispensing Machinery:
- Windows-based programming software (very user-friendly) are specially developed for various dispensing application.
- Centralized operation as well as programming ensures flawless integration between dispensing and motion
- These machinery feature constant dispensing paths both in 2D as well as 3D
- Flexible and highly configurable for stand-alone, bench-top or in-line conveyor configuration
- Dispensing programs can be easily created, and changed even by someone with no programming experience.
Areas of Applications of Contour Motion Dispensing Machinery:
- Contour Dispensing
- Bonding
- Sealing
- Gasketing
- Dot, Lines and Contours.
Extensive research and developments are going on in the field of Motion Dispensing Machinery. A innovation called Motion Platform is revolutionizing the industry with more effective operation process. This new machine maintains continuous speed with small radii and through steep curves. The steep curves are connected with uniform beads and identical knit line. Ensuring easy operation process, these machines run on windows-based programming software. Apart from gasketing, sealing and bonding, other application areas of these machines are encapsulation as well as filling.
|
|
|
|